High-Temp Polyimide Masking Tape
FUNSMT high-temp polyimide masking tape withstands 260–280°C continuous operation for SMT reflow and wave soldering. It shields gold fingers, PCB components, and battery contacts with superior dielectric insulation, then removes cleanly without residue.
Protect your most sensitive electronics with Funsmt’s Premium Polyimide Tape. Engineered for the rigors of SMT reflow and wave soldering, this high-performance masking tape combines exceptional thermal stability with superior dielectric insulation, ensuring residue-free protection for gold fingers, PCB components, and lithium batteries.
Industrial-Grade Performance
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Extreme Thermal Stability: Rated for continuous operation between 260°C and 280°C, making it ideal for the high-temperature environments of lead-free soldering processes.
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Superior Chemical & Solvent Resistance: Formulated to withstand aggressive cleaning solvents and flux, maintaining a secure bond without degradation or edge lifting.
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Residue-Free Silicone Adhesive: Features a premium pressure-sensitive silicone resin that adheres firmly to uneven surfaces but can be released easily after heating, leaving zero adhesive ghosting or residue on your gold fingers.
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Advanced Dielectric Insulation: Provides high-tier electrical insulation, making it the trusted choice for splicing wires, motor insulation, and protecting high-density lithium-ion battery packs.
Technical Specifications
| Feature | Details |
| Material Base | Premium Polyimide Film (Kapton Type) |
| Adhesive Type | High-Performance Silicone Resin |
| Heat Resistance | 260°C – 280°C |
| Width Options | Customizable from 3mm to 500mm |
| Roll Length | Standard 33m / 66m (Custom lengths available) |
| Colors | Classic Amber (Brown) / Industrial Green |
Critical Applications
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SMT Gold Finger Masking: Protects sensitive PCB edge connectors during wave soldering or hot air leveling (HASL).
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Lithium Battery Insulation: Provides a heat-resistant barrier and structural wrap for power cells, preventing internal shorts.
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Coil & Motor Wrapping: Ideal for high-temperature motor insulation and wire splicing where traditional tapes would melt or fail.
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3D Printing Bed Surface: A preferred surface for 3D printer heat beds to ensure proper adhesion of specialized filaments.
Professional Usage Instructions
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Preparation: Ensure the surface is clean, dry, and free of oil or flux residue for maximum adhesion.
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Application: Unroll the desired length and cut with a precision blade or dispenser. Place the tape precisely over the area requiring masking or insulation.
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Bonding: Apply firm, even pressure across the surface of the tape to eliminate air bubbles and ensure a complete seal.
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Removal: After the heating cycle is complete and the board has slightly cooled, peel the tape at a 45-degree angle for the cleanest release.
Frequently Asked Questions
What is the maximum operating temperature?
Rated for 260–280°C continuous operation — safe through lead-free reflow profiles and wave soldering cycles.
What can it mask during soldering?
Gold fingers, PCB components, connectors, and lithium battery contacts — anywhere you need high-temp masking with clean removal.
Does it leave residue after reflow?
No. The silicone adhesive is formulated for clean removal after high-temp exposure, leaving no sticky residue on contacts.
What is the MOQ and lead time?
There is no rigid MOQ — we support trial orders as well as volume repeats. Standard sizes ship from our U.S. warehouse (San Jose, CA) in 2–3 business days; custom specifications are made to order.
